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High tech industries united
The sector association Electronics, Micro and Nano Technologies (EMINT), newly founded in 2014, unites four of the most innovative sub-sectors of mechanical engineering. Future topics such as autonomous driving, renewable energies, electric mobility or microtechnologies are inconceivable without the know-how of our members.
The EPHJ-EPMT-SMT is the trade fair for high-precision technology in the watch industry, microtechnology and medical technology. There are more than 800 exhibitors from around 20 countries on site. Last year more than 20,000 trade visitors from all continents took part.
Compressed insight into current technologies and processes: Ever smaller products with a high degree of integration place great demands on microassembly and require innovative solutions ranging from handling, positioning and joining to plant engineering.
The EMINT spring meeting becomes international. For the first time it will take place outside Germany, in the Netherlands in Veldhoven on 10 and 11 April. The host is ASML, one of the most important global players in the semiconductor equipment industry.
The International Technology Roadmap for Photovoltaic (ITRPV) will be published in the anniversary issue (10th Edition) in mid-March with a presentation at PV Cell Tech in Malaysia. Read the trends from March 13, 2019 on itrpv.net.
VDMA sector association Electronics, Micro and Nano Technologies has now a close cooperation with the VDMA China Office in Shanghai. The member companies get additional support and services for their business in China.
Jérôme Azémar, Project Development Director at Yole Développement (Yole), offers in his presentation at the EMINT spring meting an overview of the lithography industry on "More than Moore" devices. This article is a brief introduction to his presentation, which he will give on 11 April in Veldhoven (NL) at the VDMA conference. Technology trends, industry trends and market data come from the extensive collection of reports published by Yole Développement during the year. Reports on wafer launches for More Than Moore applications, industry status quo for advanced packaging and laser technologies for semiconductor manufacturing are part of this collection.
OPC UA is an open interface standard that defines the mechanisms of collaboration in the industrial environment. It enables machines and plant engineering to digitally network their production. The relevance of OPC UA for mechanical and plant engineering will be discussed in the event using a practical example.
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